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| 机器型号 Model Type | RC-E1325 | RC-E1530 | Option | |
|---|---|---|---|---|
| 切割范围Max cutting range | 1300*2500mm | 1500*3000mm | According to demands | |
| 激光介质Laser medium | 半导体泵浦连续掺镜光纤Semiconductor pumped continuousyb-doped fiber | |||
| 激光功率Laser power | 300w/500w/1000w/2000w(可选Option SPI 400w） | |||
| 切割行程Working area | 1300*2500mm | 1500*300mm | ||
| 切割速度Max cutting speed | 0-30m/min (视材料厚度而定Depending on the material and thickness) | |||
| 重复定位精度Repeat positioning accuracy | ±0.02mm | |||
| 整机耗电功率Total electric power | ＜9kw | ＜13kw | ||
| 电力需求Power supply | 380V50Hz/60Hz/60A | |||
| 占地尺寸Floor space | 9000*5000mm(以1500*3000为列To working area 1500*3000mm for example) | |||
