Product application★Cutting a variety of flexible circuit board materials and mulch, clean and free of carbon, including common manufacturing circuit board materials and component parts manufacturing materials.
★Can cut a variety of substrate materials, such as silicon wafers, ceramics, glass etc.
★Precision etching various functional films
Product features
★High performance UV laser: uses the high beam quality, high peak power, short pulse width and high
pulse stability imported 10W/355nm, all-solid-state ultraviolet laser , ensure quality and stability
★Optimal design of optical systems: super high beam quality, reducing power consumption, reducing the
focal spot size to ensure that UV laser machining accuracy
★Using precision two-dimensional stage and full closed loop CNC system: ensure positioning and
repeat accuracy
★Using position sensor and CCD imaging location technology: laser beam datum points and Datum
point high precision of machine tools overlap
★Use highly rigid machine tool cushion blocks design, vibration reduction and natural granite base,
start/stop and speed up the process of the Elimination of worktable inertial vibration 
