ST-D-LME 端面泵浦半导体激光打标机
ST-D-LME End-pump diode Laser Marking Machine
产品特点
■光纤耦合半导体激光端面泵浦方式
■风冷或水冷方式
■高峰值功率,高精度的打标质量
■激光光束质量好,为单模
■整机能耗低,免维护,使用寿命长
Product features
●Fiber coupled semiconductor laser end amplification
●Air cooling or water cooling
●High peak power, high precise marking quality
●High laser beam quality,single mode
●Low energy loss, maintenance free, long service life, stable performance
技术参数 Technical parameter
输出功率 Laser power 12W/25W
激光波长 Wavelength 1064nm
光束质量 Beam quality ㎡<3
标刻范围 Marking scope 65×65/110×110/160×160mm(可选 optional)
标刻速度 Marking speed ≤7000mm/s
标刻深度 Marking depth ≤0.2mm(视材料可调 adjustable to materials)
最小线宽 Minimum line width 0.003mm
最小字符 Min. Character 0. 15mm
重复精度 Repeat precision ±0.005mm
供电电源 Power supply 220V±10% 50Hz/12A
输入功率 Input power ≤0.6KW(风冷 air cooling)
≤1.0KW(水冷 water cooling)
适用材料 Applicable Materials
任何金属、ABS、PVC、PET、陶瓷材料等
All metal, ABS, PVC, PET, ceramics and so on
适用领域 Applicable Industry
塑胶透光按键,电子元器件,手机通讯,电工电器,汽车配件,箱包饰扣等行业
Plastic transparent button, electric apparatus, and telecom products, electric equipment, auto part, ornamental button and fastener of boxes and bags and so on